학술논문

Rapid prototyping of electronic modules combining Aerosol printing and Ink Jet printing
Document Type
Conference
Source
3rd Electronics System Integration Technology Conference ESTC Electronic System-Integration Technology Conference (ESTC), 2010 3rd. :1-6 Sep, 2010
Subject
Components, Circuits, Devices and Systems
Communication, Networking and Broadcast Technologies
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Power, Energy and Industry Applications
Robotics and Control Systems
Signal Processing and Analysis
Copper
RNA
Language
Abstract
Maskless direct printing is a good candidate for rapid prototyping and even emerging for manufacturing of large scale electronics. Aiming for rapid prototyping of small multi-layer modules the study combines Aerosol Jet ® printing and ink jet printing. Conductive silver traces down to 20µm width were printed together with large interconnect areas on isolating layers of inorganic-organic hybrid polymer (ORMOCER ® ) and on glass substrates. New copper nickel inks and high-k ORMOCER ® s filled with barium titanate particles are paving a path to integrated printed resistors and capacitors. Although some issues still need to be resolved for a commercial grade process the detail solutions presented for the first time and the active integrated circuits and devices attached to the same substrate demonstrate a path and the principle technical feasibility of this method for heterogeneous integration.