학술논문

Channel Impedance Optimization For 100 Gbps High-Speed Networking Interfaces
Document Type
Conference
Source
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Advanced Packaging and Systems (EDAPS), 2022 IEEE Electrical Design of. :1-3 Dec, 2022
Subject
Components, Circuits, Devices and Systems
Fields, Waves and Electromagnetics
Signal Processing and Analysis
Network topology
High-speed networks
IEEE 802.3 Standard
Packaging
EPON
Topology
Impedance
PCB
COM
SERDES
PAM4
Language
ISSN
2151-1233
Abstract
High-speed designs today have multiple high-speed interfaces, and these interfaces have different impedance requirements in the same system. For example: PCIe interface is designed for 85 ohms whereas Gigabit ethernet is designed for 100 ohms. Sometimes due to stack-up cross-sectional restrictions and fixed dielectric constant of the material, it is not easy to meet all characteristic impedance requirements in the design. Design trade-off needs to be performed to analyze which interface is sensitive to impedance variations. With signal speeds going above 100 Gbps, pulse amplitude modulation-4 (PAM4) has become more common and PAM4 signaling is more sensitive to impedance variations due to low signal-to-noise ratio (SNR).In this paper, the impact of channel impedance on 100 Gbps ethernet (802.3ck) interface is analyzed using time-domain and frequency domain analysis. Channel operating margin (COM) analysis is performed for various channel impedances on an 802.3ck-CR topology. It Is found that huge impedance mismatch between the trace breakout and channel impacts channel performance adversely.