학술논문
Subgrid-based equivalent circuit for transient thermal analysis using latency insertion method
Document Type
Conference
Author
Source
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2017 IEEE International Symposium on. :760-765 Aug, 2017
Subject
Language
ISSN
2158-1118
Abstract
In this paper, a subgrid scheme for the thermal equivalent circuit is proposed and combined with a latency insertion method to solve thermal problems in the time domain. Moreover, the feasible prospect of implementing the circuit-based method for the electrical-thermal co-simulation is also mentioned. Even though these problems can be analyzed by using the equivalent circuit, simulated objects often turn into a large-scale network which immensely increases computational cost. The subgrid-based equivalent circuit can reduce the total number of variables while retaining simulation accuracy by modeling the computational object with a coarse grid for its most parts, and a fine grid for small structure details. To evaluate the accuracy and efficiency of the proposed method, a thermal problem is simulated by using a standard uniform fine grid, the subgrid scheme, and a commercial simulator. The simulated results show a great improvement in computational time and excellent correlation with uniform fine grid's results.