학술논문

Subgrid-based equivalent circuit for transient thermal analysis using latency insertion method
Document Type
Conference
Source
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2017 IEEE International Symposium on. :760-765 Aug, 2017
Subject
Aerospace
Bioengineering
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Fields, Waves and Electromagnetics
General Topics for Engineers
Nuclear Engineering
Photonics and Electrooptics
Power, Energy and Industry Applications
Robotics and Control Systems
Signal Processing and Analysis
Transportation
Thermal resistance
Thermal analysis
Equivalent circuits
Heating systems
Silicon
Thermal conductivity
Latency insertion method
subgrid
thermal equivalent circuit
transient thermal analysis
Language
ISSN
2158-1118
Abstract
In this paper, a subgrid scheme for the thermal equivalent circuit is proposed and combined with a latency insertion method to solve thermal problems in the time domain. Moreover, the feasible prospect of implementing the circuit-based method for the electrical-thermal co-simulation is also mentioned. Even though these problems can be analyzed by using the equivalent circuit, simulated objects often turn into a large-scale network which immensely increases computational cost. The subgrid-based equivalent circuit can reduce the total number of variables while retaining simulation accuracy by modeling the computational object with a coarse grid for its most parts, and a fine grid for small structure details. To evaluate the accuracy and efficiency of the proposed method, a thermal problem is simulated by using a standard uniform fine grid, the subgrid scheme, and a commercial simulator. The simulated results show a great improvement in computational time and excellent correlation with uniform fine grid's results.