학술논문
Development of an inspection process for ball-grid-array technology using scanned-beam X-ray laminography
Document Type
Periodical
Author
Source
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A IEEE Trans. Comp., Packag., Manufact. Technol. A Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on. 18(4):851-861 Dec, 1995
Subject
Language
ISSN
1070-9886
1558-3678
1558-3678
Abstract
An inspection process based on scanned-beam X-ray laminography (SBXLAM) is proposed herein for quantitatively monitoring the quality of ball-grid-array (BGA) joints. The long-term reliability of the BGA joints depends on the component-assembly process producing joints with sufficient solder volume and proper alignment. Inspection algorithms were developed to measure the critical BGA-joint characteristics, including the alignment between the ball and the PCB pad, the solder thickness, and the average joint-diameter, and thus, determine whether the joints are defective. The performance of the inspection algorithms was evaluated by inspecting samples with defects that were independently verified.