학술논문

Boron diffusion in silicon
Document Type
Periodical
Source
IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 32(11):2322-2330 Nov, 1985
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Language
ISSN
0018-9383
1557-9646
Abstract
Well-defined control of high-and low-temperature anneals of boron implanted in silicon is important in the calculation of shallow p-n junction profiles used in MOSFET's. Here, a sample matrix of boron implanted into silicon over a range of fluences and annealing temperatures is considered. The matrix of samples was measured by SIMS (secondary ion mass spectrometry). The measured profiles were compared with simulations from an annealing/diffusion model. Calculations of the annealed profiles were found to be in agreement with the SIMS data at temperatures greater than 1000°C. At lower temperatures, the profiles exhibit effects due to implantation damage which are not included in the diffusion model.