학술논문

Construction and Verification of Hyperelastic Constitutive for Polymer Materials
Document Type
Conference
Source
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022
Subject
Components, Circuits, Devices and Systems
Fields, Waves and Electromagnetics
Photonics and Electrooptics
Signal Processing and Analysis
Analytical models
Mathematical models
Batteries
Finite element analysis
Behavioral sciences
Plastics
Reliability
Hyperelastic
constitutive
polymers
finite element analysis (FEA)
drop analysis
Language
Abstract
Finite element analysis (FEA) has become an important tool for evaluating drop reliability of consumer electronic products. However, the accuracy of FEA highly depends on the prediction of material constitutive, i.e., the stress-strain behavior. For polymers, lots of them are viscoelastic or hyperelastic, which could be described by different kinds of constitutive models. Thus, how to quickly obtain the material constitutive with high precision is a problem worthy of in-depth study. In this paper, for a commercial battery adhesive material, the stress-strain curve is obtained by uniaxial tension and plane tension experimental tests. Then its constitutive equation is tried to be constructed using Neo-Hooke, Mooney-Rivlin, Reduced-Polynomial, Ogden and Arruda-Boyce model. We evaluated the applicability of different models in detail, and finally found that Ogden model could describe the with relative larger initial modulus among all of these hyperelastic models. After that, we use the second-order Ogden model to successfully construct the constitutive for the adhesive material, which is further performed in actual drop analysis within whole smartphone product structure.