학술논문

Thermal Interactions Between Electromigration Test Structures
Document Type
Conference
Source
Proceedings of the IEEE International Conference on Microelectronic Test Structures Microelectronic Test Structures, 1988. ICMTS. Proceedings of the 1988 IEEE International Conference on. :132-137 1988
Subject
Components, Circuits, Devices and Systems
Electromigration
Thermal stresses
Temperature
Electrical resistance measurement
Thermal resistance
Heat sinks
Metallization
Electronic packaging thermal management
Electronic equipment testing
Semiconductor device measurement
Language

Online Access