학술논문

Transient Thermal Modeling of Power Semiconductors for Long-Term Load Profiles
Document Type
Conference
Source
2023 IEEE Applied Power Electronics Conference and Exposition (APEC) Applied Power Electronics Conference and Exposition (APEC), 2023 IEEE. :2569-2574 Mar, 2023
Subject
Power, Energy and Industry Applications
Dictionaries
Computational modeling
Time series analysis
Multichip modules
Predictive models
Thermal analysis
Thermal loading
Language
ISSN
2470-6647
Abstract
This paper presents an improved thermal analysis method focusing on the long-term profiles of power modules. A shift-invariant dictionary method is developed to extract the critical atoms to sparsely represent time series signals. Then the temperature response of the power module can be approximated by a sparse linear combination of basis functions. The performance of the proposed method is compared with the convolution method, the result indicates that the transient junction temperature of the power module can be predicted with less computational effort. The simulation and experimental results also prove that the proposed method can effectively reconstruct the thermal behavior, exhibits good predictive capability and is suitable for temperature prediction under long time scales.