학술논문
Flip-Chip Integration of InP and SiN
Document Type
Periodical
Author
Source
IEEE Photonics Technology Letters IEEE Photon. Technol. Lett. Photonics Technology Letters, IEEE. 31(3):273-276 Feb, 2019
Subject
Language
ISSN
1041-1135
1941-0174
1941-0174
Abstract
We present an interface for hybrid flip-chip integration of InP-based laser sources to silicon-nitride-based photonic platforms. The design enables efficient high optical power coupling over a wide temperature range. The optical modes of laser and SiN chip are expanded using integrated tapers allowing for high alignment tolerance. The chips comprise physical alignment stops for vertical alignment. In the horizontal direction, the integration interface is optimized for active and/or visual alignment with high precision using precise visual alignment marks. The hybrid integrated chip shows a waveguide coupled optical power of more than 40 mW and can operate at elevated temperatures up to 85 °C.