학술논문

Remote Control of Doping Profile, Silicon Interface, and Gate Dielectric Reliability via Oxygen Insertion into Silicon Channel
Document Type
Conference
Source
2022 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK) Future of Electron Devices, Kansai (IMFEDK), 2022 IEEE International Meeting for. :1-4 Nov, 2022
Subject
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Power, Energy and Industry Applications
Signal Processing and Analysis
Oxygen
Scattering
Lattices
Logic gates
Doping profiles
Silicon
Surface roughness
oxygen insertion
implant anchoring effect
electron mobility
TDDB
Language
Abstract
Insertion of partial monolayers of oxygen atoms into Si lattice leads to modification of formation enthalpy of various dopants and point defects, enabling remote control of doping profiles away from the inserted film. 18 O isotope tracer revealed exchange of oxygen atoms between oxygen-insertion layers and gate oxide. This finding likely accounts for 35% improvement of surface roughness scattering rate of inversion electrons as well as 6x improvement of charge-to-breakdown of thin gate dielectrics experimentally observed. Impact of the OI(oxygen inserted)-Si channel is greater for HKMG(high-k metal gate) stack due to modification of interface charge properties.