학술논문

Sensitivity Enhancement of Thermal Piezoresistive Resonant MEMS Sensors Using Mechanical Coupling and DC Tuning
Document Type
Periodical
Source
Journal of Microelectromechanical Systems J. Microelectromech. Syst. Microelectromechanical Systems, Journal of. 31(5):760-770 Oct, 2022
Subject
Engineered Materials, Dielectrics and Plasmas
Components, Circuits, Devices and Systems
Resonators
Sensors
Resonant frequency
Sensitivity
Couplings
Couplers
Micromechanical devices
Coupled-resonator
DC tuning
fully differential
mode localization
MEMS
mass sensor
SOI MEMS process
thermal piezoresistive resonator
viscous damping
Language
ISSN
1057-7157
1941-0158
Abstract
In this work, we present a Silicon on Insulator (SOI) mechanically coupled MEMS device composed of three rotating ring resonators for enhancing its sensitivity. It shows the exploration of Thermal Piezoresistive (TPR) transduction in mechanically coupled ring resonators for mass sensing applications. Mass sensing experiments are performed by dropping the silver nano drops on the surface of the resonator. It includes the first-time investigation of a three degree of freedom (3-DOF) differential ring-shaped TPR (DR-TPR) MEMS coupled-resonator and involves the selection of the best configuration of the differential drive and sense scheme that enhances the signal-to-noise ratio (SNR) using feedthrough cancellation. Amplitude change and amplitude ratio offer an enhancement in normalized sensitivity by 92 and 131 times respectively along with the common-mode rejection in comparison to their frequency shift counterparts. This coupled-resonator can show a quality factor of more than 1300 in ambient conditions, facilitating the resolution and DC tunability improvement. This work paves the way to realize various sensors for ambient environment applications. [2022-0045]