학술논문
Case studies on application of Time Resolved Imaging Emission Microscopy for backside timing analysis
Document Type
Conference
Author
Source
2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the. :1-4 Jul, 2012
Subject
Language
ISSN
1946-1542
1946-1550
1946-1550
Abstract
We studied a backside timing analysis technique utilizing Time Resolved Imaging Emission Microscopy (TRIEM) which can acquire emission data locations and timing simultaneously from an activated LSI chip. In this paper, we will present two case studies of actual failed chips. One is a delay fault case, and the other is a current fault case. Then, we will propose an analysis flow applying TRIEM based on the experimental results.