학술논문
Fast and Accurate Modeling of PCB Differential Trace Skew Compensation using ML
Document Type
Conference
Author
Source
2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Electrical Performance of Electronic Packaging and Systems (EPEPS), 2021 IEEE 30th Conference on. :1-3 Oct, 2021
Subject
Language
ISSN
2165-4115
Abstract
High Speed Serial interfaces using differential routing require intra-pair delay matching to minimize loss and electromagnetic interference due to differential to common mode conversion. Existing layout methods using geometric length are useful to avoid gross errors, but fall short as the electrical length is a non-linear 3D problem that is dependent on self-coupling and return path. This paper investigates this issue and compares different regression models to improve skew compensation accuracy and speed.