학술논문

High power modulator new design architectures enabled by new 200/spl deg/C-class high temperature insulation: a preliminary investigation
Document Type
Conference
Source
Conference Record of the 2000 Twenty-fourth International Power Modulator Symposium Power modulator symposium Power Modulator Symposium, 2000. Conference Record of the 2000 Twenty-Fourth International. :187-190 2000
Subject
Power, Energy and Industry Applications
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Robotics and Control Systems
Temperature
Voltage
Partial discharges
Thermal management
Dielectric materials
Dielectric substrates
Laminates
Dielectrics and electrical insulation
Testing
Building materials
Language
ISSN
1076-8467
Abstract
An advanced insulating material developed for thermal management, with a 150/spl deg/C glass transition temperature (T/sub g/) in a laminate insulated metal substrate (IMS/sup TM/) construction, is characterized for its especially low partial discharge behavior. Rounding all sharp edges, and testing while immersed in dielectric fluid eliminates discharges in air above the test assembly. The insulation's partial discharge inception voltage (PDIV) at room temperature, in a dielectric fluid environment, is above 4000 V, at 60 Hz AC. This material has shown to withstand aging in air at temperatures and DC voltages as high as 175/spl deg/C and 960 V, up to 2000 hours. This new material is available in square feet area sizes and represents the first new high voltage (i.e., for voltages >24 V/sub ac/dc/) large area laminate insulation for thermal management of next generation medium voltage high power modulators. Partial discharge (PD) testing, such as its inception and extinction voltages (PDIV and PDEV), may be used to assess the presence of microelectric discharges in insulating systems at design operating voltages. Through accelerated aging, PD activity can be utilized as a quality control to predict material life in design and qualification of a material for power applications.