학술논문

Prediction of the Number of Defects in Image Sensors by VM Using Equipment QC Data
Document Type
Periodical
Source
IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 32(4):434-437 Nov, 2019
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Predictive models
Data models
Semiconductor device measurement
Regression tree analysis
Image sensors
Manufacturing
Big data
virtual metrology (VM)
partial least squares (PLS) regression
regression tree
stepwise AIC
hockey-stick regression model
generalized linear model (GLM)
Language
ISSN
0894-6507
1558-2345
Abstract
This paper describes methods and evaluation results of predicting the number of defects in image sensors using equipment QC data. Virtual metrology (VM) models are mainly used for measurable values such as dimensions and electrical characteristics. Herein, to predict countable values, we used a regression tree and stepwise AIC for variable selection as well as the “hockey-stick regression model” and generalized linear model for regression, instead of the partial least squares (PLS) regression. The results showed an improved prediction performance in comparison with the conventional method. This method can be used to predict other countable values such as defects or dust particles.