학술논문
Novell test concept for experimental lifetime prediction of miniaturized lead-free solder contacts
Document Type
Conference
Author
Source
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. Thermal mechanical and multi-physics simulation and experiments in micro-electronics and micro-syste Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on. :86-90 2005
Subject
Language
Abstract
Many investigations in lead-free solder-bumps on real components have been done with more or less successful lifetime prediction. Thermo-mechanical loads during temperature cycle test e.g. -40/spl deg/ to +125/spl deg/C the solder materials weaken thru time independent and time dependent plastically deformation. Solder bumps underneath real packages usually with chip on interposer are not only stressed by shear forces but also by tensile force in z-direction. The collected data may match the studied component very well, but is it possible to transfer it to other electronic packages?.