학술논문

Operation Up to 500 °C of Al0.85Ga0.15N/Al0.7Ga0.3N High Electron Mobility Transistors
Document Type
Periodical
Source
IEEE Journal of the Electron Devices Society IEEE J. Electron Devices Soc. Electron Devices Society, IEEE Journal of the. 7:444-452 2019
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
HEMTs
MODFETs
Temperature measurement
Gallium nitride
Temperature
Aluminum gallium nitride
Wide band gap semiconductors
AlGaN
GaN
high electron mobility transistor (HEMT)
high temperature
Language
ISSN
2168-6734
Abstract
AlGaN channel high electron mobility transistors (HEMTs) are the potential next step after GaN channel HEMTs, as the high aluminum content channel leads to an ultra-wide bandgap, higher breakdown field, and improved high temperature operation. Al 0.85 Ga 0.15 N/Al 0.7 Ga 0.3 N (85/70) HEMTs were operated up to 500 °C in ambient causing only 58% reduction of dc current relative to 25 °C measurement. The low gate leakage current contributed to high gate voltage operation up to +10 V under V ds = 10 V, with $\text{I}_{\mathrm{ ON}}/\text{I}_{\mathrm{ OFF}}$ ratios of $> 2 \times 10^{11}$ and 3 $\times \,\,10^{6}$ at 25 and 500 °C, respectively. Gate-lag measurements at 100 kHz and 10% duty cycle were ideal and only slight loss of pulsed current at high gate voltages was observed. Low interfacial defects give rise to high quality pulsed characteristics and a low subthreshold swing value of 80 mV/dec at room temperature. Herein is an analysis of AlGaN-channel HEMTs and their potential future for high power and high temperature applications.