부산대학교 도서관

The scale of neural networks for Artificial Intelligence is ever increasing to achieve human-level intelligence. The era of data explosion computing is evolving with the advent of the huge AI network operating on huge amount of data including parameters, images, sentences, and etc. Designing AI processor which is the computational foundation of the data explosion computing is facing physical limitation of semiconductors as well as skyrocketing cost. The chiplet processor integrating multiple dies into a single chip is a viable solution to deal with AI processors for data explosion computing. The chiplet-based design compared to IP-based design provides much higher performance with lower cost. In this paper, we present design aspects of chiplet AI processor including the architecture design for incorporating NPU chiplets, HBM chiplets, and 2.5D interposers, signal integrity for high-speed interconnections on the interposer, PDN for chiplets, chiplet-bonding reliability, thermal stability, and chiplet link for inter-chiplet data transfer on heterogeneous integration architecture.