학술논문
Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation
Document Type
Conference
Author
Source
2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2012 Symposium on. :98-102 Apr, 2012
Subject
Language
Abstract
This paper presents the use of micro-particle imaging velocimetry (micro-PIV) to analyse fluid flow and hence ion replenishment in PCB micro-via during the electroplating process. Megasonic streaming is used to remove bubbles from blind micro-via and promote ion transportation within high aspect ratio PCB micro-via to enhance electrodeposition.