학술논문
A cost-effective thermal managed high output power VECSEL with hybrid mirror on Copper substrate at l,55µm
Document Type
Conference
Source
IPRM 2011 - 23rd International Conference on Indium Phosphide and Related Materials Compound Semiconductor Week (CSW/IPRM), 2011 and 23rd International Conference on Indium Phosphide and Related Materials. :1-4 May, 2011
Subject
Language
ISSN
1092-8669
Abstract
A 1.55 µm OP-VECSEL with electro-deposited copper substrate was optimized for lasing operation. It is a cost-effective solution compared with CVD diamond substrate assembled by metallic bonding. Experimental results showed that the effective thermal resistance R th of a 60-µm diameter OP-VECSEL with ∼150-µm thick copper substrate was 34±3 K/W. In plane concave cavity, maximum output power of 42,3mW was achieved at 25°C when a 980nm single mode pump laser with pump power ∼450mw was used, showing the potentiality of external cavity semiconductor disk lasers to generate mode-locked pulse train at 1.55 µm when it will be assembled with a fast saturable absorber mirror (SESAM).