학술논문
RF MEMS fabrication in LTCC technology
Document Type
Conference
Author
Source
2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2016 Symposium on. :1-5 May, 2016
Subject
Language
Abstract
RF MEMS in Low-Temperature Co-fired Ceramics (LTCC) technology have been designed, manufactured and tested for potential utilization in reconfigurable space sub-systems. Specifically, single-pole-single-throw (SPST) and single-pole-double-throw (SPDT) ohmic switch configurations have been studied for wide-band applications. Advantages coming from the measured RF performances and from the integration of RF MEMS by means of the LTCC technology only, to be used also for packaging, are discussed.