학술논문
Creep Viscoplastic Characterization of SAC Solders Exposed to Different Isothermal Aging
Document Type
Conference
Source
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2023 IEEE International Symposium on the. :1-4 Jul, 2023
Subject
Language
ISSN
1946-1550
Abstract
In this paper, the study aims to characterize the creep mechanical properties of 3 SAC solder alloys (SAC305, SAC302, and Cyclomax) under 3 isothermal aging temperature (-40, 25C, and 125C). The study will further fit into the Garofalo hyperbolic sine material model. Last, the study will list out a table comprising each model variables value of three SAC solders with respect to low, room and high temperature.