학술논문

Through-Silicon Isolation Based on Dry Filling and Reflow of Micron Glass Powders
Document Type
Conference
Source
2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2024 IEEE 37th International Conference on. :697-700 Jan, 2024
Subject
Bioengineering
Components, Circuits, Devices and Systems
Fields, Waves and Electromagnetics
Photonics and Electrooptics
Power, Energy and Industry Applications
Vibrations
Mechanical sensors
Micrometers
Powders
Magnetic sensors
Glass
Mirrors
Through-Silicon Insulation
Glass Particles
Reflow
Dry Filling
Monolayered Combs-angle-sensor-integrated Biaxial Gimbal
Language
ISSN
2160-1968
Abstract
This paper, for the first time, introduces glass powders into through-silicon isolation, and fabricates a monolayered combs-angle-sensor-integrated biaxial gimbal with 250μm-thickness and 1cm-diameter. Micron dry glass powders are filled into through holes by a silica-gel scraper, which is followed by surface cleaning to wipe off residual powders and reflow to turn these incompact glass powders into solidified glass liners respectively. These glass liners electrically insulate combs angle sensors from the main body of gimbal while maintaining robust mechanical connections. This gimbal is applied to development of magnetically-driven and closed-loop controlled mirror with millimeter-level size. Experimental results reveal that the insulation resistance value of each glass liner reaches TΩ-level. Furthermore, the glass liner is proved to be tolerant to mechanical impact and vibration in the process of assembling magnetic actuator and mirror onto this gimbal.