학술논문

Ultrasonic Test Structures for Non-Destructive Measurement of Trapezoidal Angle in Bosch Processes
Document Type
Conference
Source
2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) Solid-State Sensors, Actuators and Microsystems (Transducers), 2023 22nd International Conference on. :1500-1503 Jun, 2023
Subject
Bioengineering
Components, Circuits, Devices and Systems
Fields, Waves and Electromagnetics
Photonics and Electrooptics
Robotics and Control Systems
Micromechanical devices
Sensitivity
Transducers
Ultrasonic variables measurement
Resonant frequency
Predictive models
Optical variables measurement
Bosch process
ultrasonics
test microstructures
non-destructive evaluation
trapezoidal angle
Language
ISSN
2167-0021
Abstract
This paper reports a new, simple and non-destructive approach based on ultrasonic interrogation to measure the trapezoidal angle of anisotropically etched silicon micropillars (e.g. by the Bosch Process). The approach is based on a test structure—a lattice of vertical micropillars—designed to resonate close to 5 MHz. Experiments and finite element simulations are utilized to explain the sensitivity of the resonance frequency of our test structure. With a design radius of 30 μm (45 μm), a max. (min.) sensitivity of 0.73 MHz/deg (0.47 MHz/deg) is demonstrated. We propose an analytical formula to relate the resonance frequency to the trapezoidal angle and radius of the micropillars.