학술논문
Silicon Taper Based $D$ -Band Chip to Waveguide Interconnect for Millimeter-Wave Systems
Document Type
Periodical
Author
Source
IEEE Microwave and Wireless Components Letters IEEE Microw. Wireless Compon. Lett. Microwave and Wireless Components Letters, IEEE. 27(12):1092-1094 Dec, 2017
Subject
Language
ISSN
1531-1309
1558-1764
1558-1764
Abstract
This letter presents a novel interconnect for coupling millimeter-wave (mmW) signals from integrated circuits to air-filled waveguides. The proposed solution is realized through a slot antenna implemented in embedded wafer level ball grid array (eWLB) process. The antenna radiates into a high-resistivity (HR) silicon taper perpendicular to its plane, which in turn radiates into an air-filled waveguide. The interconnect achieves a measured average insertion loss of 3.4 dB over the frequency range of 116–151 GHz. The proposed interconnect is generic and does not require any galvanic contacts. The utilized eWLB packaging process is suitable for low-cost high-volume production and allows heterogeneous integration with other technologies. This letter proposes a straightforward cost-effective high-performance interconnect for mmW integration, and thus, addressing one of the main challenges facing systems operating beyond 100 GHz.