학술논문

Copper Encapsulated Ultra-Thin NbN Films and Damascene Structures on 300 mm Si Wafers

Document Type

Periodical

Author

Kar, S.; Walker, H.; Shah, A.; Frost, H.; Olson, S.; Mucci, J.; Nalaskowski, J.; Martinick, B.; Schujman, S.; Murray, T.; Johnson, C.S.; Wells, I.; Bourque, R.; Pierce, S.; Bhatia, E.; Hamilton, M.C.; Rao, S.S.P.

Source

IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 33(5):1-5 Aug, 2023

Subject

Fields, Waves and Electromagnetics
Engineered Materials, Dielectrics and Plasmas
Niobium compounds
Films
Silicon
Semiconductor device measurement
Cryogenics
Nanowires
Thickness measurement
Critical current
damascene
nanowires
NbN film
superconducting wires
ultra-thin

Language

ISSN

1051-8223
1558-2515
2378-7074

Abstract

In this report, the development of reactively sputtered ultra-thin niobium nitride (NbN) films and their fabrication into patterned structures using 193 nm optical lithography on 300 mm scale is presented. The target composition of NbN film with Cu encapsulation showed a critical temperature ( T c ) of ∼9.5 K (at a thickness of ∼50 nm), with

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