학술논문

High-Aspect-Ratio Thin-Film Stiffening Structures Made of Atomic-Layer-Deposited Alumina and Its Application to a Scanning Micromirror
Document Type
Periodical
Source
Journal of Microelectromechanical Systems J. Microelectromech. Syst. Microelectromechanical Systems, Journal of. 32(4):352-361 Aug, 2023
Subject
Engineered Materials, Dielectrics and Plasmas
Components, Circuits, Devices and Systems
Silicon
Etching
Fabrication
Micromirrors
Micromechanical devices
Ions
Deformation
Atomic layer deposition
alumina
freestanding thin film
thin film stiffening structure
silicon deep reactive ion etching
micromirror
Language
ISSN
1057-7157
1941-0158
Abstract
This work presents the first high-aspect-ratio alumina stiffening structures, fabricated by combining atomic layer deposition (ALD) of alumina with silicon deep reactive ion etching (Si-DRIE), designed to improve MEMS micromirror devices. By selective etching of an alumina-coated silicon mold, we produced vertical alumina fins with a depth up to $500 \mu \text{m}$ and a width down to $0.13 \mu \text{m}$ , corresponding film-aspect-ratios up to 3800. We applied this stiffening structure to a lightweight MEMS micromirror with $215 \mu \text{m}$ thickness and 2 mm diameter. We characterized the optical flatness and dynamic deformation of this device, which are quantities of interest for compact image projection systems.