학술논문
D2W Hybrid Bonding Challenges for HBM
Document Type
Conference
Author
Source
2024 IEEE International Memory Workshop (IMW) Memory Workshop (IMW), 2024 IEEE International. :1-4 May, 2024
Subject
Language
ISSN
2573-7503
Abstract
This paper addresses the key requirements for a successful Die-to-Wafer hybrid bonding process for die stacking. The paper delves into requirements, principles, challenges, and advancements made using integrated processing equipment. The process requires key surface preparation steps integrated with the Hybrid bonders to achieve the highest levels of yield. Unique challenges for memory stacking including thin die handling, alignment, front and backside surface preparation.