학술논문
Diamond wafer for SAW application
Document Type
Conference
Author
Source
1997 IEEE Ultrasonics Symposium Proceedings. An International Symposium (Cat. No.97CH36118) Ultrasonics symposium Ultrasonics Symposium, 1997. Proceedings., 1997 IEEE. 1:183-186 vol.1 1997
Subject
Language
ISSN
1051-0117
Abstract
A three inch wafer of polycrystalline diamond on silicon has been successfully developed. High uniformity of quality of diamond and almost defect free diamond surface associated with high quality ZnO exhibit wonderful performance of diamond SAW devices. It was also observed that this material system has super high power handling capability, smaller temperature deviation compared with 36 Y cut and ST cut quartz, low phase slope characteristics in the passband, and extremely high breakdown voltage. A variety of applications are expected with the material system utilizing these features.