학술논문
Packaging of Ultra-dynamic Photonic Switches and Transceivers for Integration into 5G Radio Access Network and Datacenter Sub-systems
Document Type
Conference
Author
Van Steenberge, G.; Roelkens, G.; Ossieur, P.; Missinne, J.; Van Asch, J.; Zhang, J.; Qin, S.; Van Campenhout, J.; Van Kerkhof, J.; Milosevic, M. M.; Bakopoulos, P.; Syrivelis, D.; Mentovich, E.; Morozov, K.; Stracca, S.; Bigongiari, A.; Joerg, T.; Schlick, D.; Braun, T.; Wohrmann, M.; Gernhardt, R.; Cheng, Q.; Li, T.; Penty, R.
Source
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :742-747 May, 2023
Subject
Language
ISSN
2377-5726
Abstract
We report the development of a fully non-blocking optical switch fabric, enabling a deterministic and dynamic network infrastructure. Focus is on scalable photonic integration and packaging technologies required to develop a low-cost switch fabric, including micro-transfer-printing of amplifiers, FOWLP for dense photonic-electronic integration, and optical/thermal packaging solutions on IC-substrates.