부산대학교 도서관

In this work, a microwave dielectric material consisting of an RT6002 substrate was used in the new packaging architecture design of a transceiver (T/R) module. The study showed that it was difficult to obtain good vertical interconnections of TMVs with a high-aspect-ratio following the standard method of solder paste fillings in PoP packaging. Therefore, a new metallization interconnection method consisting of pre-embedding copper pillars was proposed to replace the regular solder paste filling for the metallization of TMVs. In addition, special frock clamps were designed to ensure the planting accuracy of the copper pillars. The experimental tests proved that reliable vertical metallization interconnections of the TMVs could be obtained using this new method, and the failure of TMVs metallization could be avoided.