학술논문
Research on the packaging reliability and degradation models of quality factors for a high vacuum sealed MEMS gyroscope
Document Type
Conference
Author
Source
2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2017 19th International Conference on. :1077-1080 Jun, 2017
Subject
Language
ISSN
2167-0021
Abstract
This paper proposes a novel evaluation method for MEMS gyroscopes' packaging reliability. Based on the principles of thermodynamics and hydromechanics, the relationships among quality factors, air pressure, and gas number, as well as degradation models of them, are deducted for the first time. Experimental tests demonstrate that the relationships between the reciprocals of the two-mode quality factors and air pressure are approximately piecewise linear. Besides, the relationships between the reciprocals of quality factors and accelerated aging time are exponential, which accord with the theoretical analysis.