학술논문

Microcavity Plasma Arrays Based on Encapsulated Al/Al2O3 Electrodes: Device Efficiency and Electrical Characteristics for Display Applications
Document Type
Conference
Source
2007 IEEE 34th International Conference on Plasma Science (ICOPS) Plasma Science, 2007. ICOPS 2007. IEEE 34th International Conference on. :182-182 Jun, 2007
Subject
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Components, Circuits, Devices and Systems
Power, Energy and Industry Applications
Nuclear Engineering
Microcavities
Plasma devices
Large-scale systems
Electrodes
Plasma chemistry
Plasma materials processing
Robustness
Nonhomogeneous media
Chemical processes
Thin film devices
Language
ISSN
0730-9244
Abstract
A group of robust microcavity plasma devices has been fabricated in Al/Al 2 O 3 multilayer structures by drawing upon wet chemical processing to grow thin films of nanostructured Al 2 O 3 directly from the Al substrate. Addressable, large scale arrays of microcavity plasma devices having cavities with a diameter of 100-200 mum are successfully formed by a process suitable for low cost manufacturing. This presentation reports device structure and cell designs of microcavity devices for the microdischarge in the various contents of Ne/Xe gas mixture. 20 times 20 arrays of ~200 mum dia. devices operate stably with a Xe content of 10% (and higher) and the pixel-to-pixel emission intensity is quite uniform over the pressure range of 400-800 Torr. The turn-on voltage at Ne/30% Xe was measured to be ~228V without a coating of MgO and the current value was decreased to the 30% of original current in bulk electrode after patterning aluminum electrode. The detailed electrical properties of the device and novel process for the fabrication of large scale arrays (hundreds of cm 2 ) will be presented.