부산대학교 도서관

The high thermal dissipation is one of the most urgent issues for the diverse utilization of advanced power electronic devices (SiC, GaN, GaO). Adoption of sub¬micrometer sized copper particles as die bonding materials could be a solution in terms of its high performance and material cost. In this study we investigated the copper-copper ultrasonic bonding using by porous pre-sintered copper layer with relatively low-power blue laser to apply as the bonding method. The results showed that rapid copper-copper bonding could be achieved by ultrasonic bonding with the homogenous layer by plastic deformation of porous sintered layer.