학술논문
Classification of Solder Quality in Through-Hole Devices by Convolutional Neural Networks
Document Type
Conference
Author
Source
2022 Innovations in Intelligent Systems and Applications Conference (ASYU) Intelligent Systems and Applications Conference (ASYU), 2022 Innovations in. :1-4 Sep, 2022
Subject
Language
ISSN
2770-7946
Abstract
Solder inspection has an important place in electronic board production. Deep learning methods can be used to control the quality of solders. In this paper, a comparative study on the performance of deep learning methods for the classification of solder quality of through-hole devices is presented. The dataset used contains 7320 pieces of data. Soldering quality will be classified using three different networks based on ResNet, Inception-v4 and Inception-ResNet, which were created in this study. The test results obtained will be compared.