학술논문
Opto-Mechanical System design for characterizing multiple channel free space optical interconnect components
Document Type
Conference
Author
Source
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :160-164 Dec, 2023
Subject
Language
Abstract
In this paper, we present an enhanced opto-mechanical hardware designed to address the challenges of high data rate optical interconnects, featuring both Free-Space and fiber-based Optical communication. Our hardware work builds upon our previous paper [1], introducing novel features to optimize coupling efficiency and alignment tolerance. We developed an enhanced opto-mechanical hardware to align linear array of Vertical-Cavity Surface-Emitting Lasers (VCSELs) and Photodetectors (PINs) assembled in a small form factor solderable component. The setup provides High-Speed data through 12-channels by using a Dove prism, running at a throughput of 16Gbps per channel, provided by a custom-made optical interconnect called LightKonnect™ [4]'This opto-mechanical hardware provides the freedom to adjust the retro reflecting prism in lateral and longitudinal directions, achieving an alignment tolerance of 50 microns. DOI: 10.1109/EPTC56328.2022.10013287