학술논문
Integrity of ceramic packages upon liquid nitrogen cycling
Document Type
Conference
Author
Source
Proceedings., 39th Electronic Components Conference Electronic Components Conference, 1989. Proceedings., 39th. :539-543 1989
Subject
Language
Abstract
The integrity of two types of test packages (A and B) during cycling between 30 degrees C and liquid nitrogen temperature (-196 degrees C) is discussed. Type-A packages had polyimide-insulated chips and were characterized by higher thermal shear strain amplitudes (