학술논문

S3-P3: Advanced no-field-plate AlGaN/GaN hemts for millimeter-wave MMIC applications
Document Type
Conference
Source
2014 Lester Eastman Conference on High Performance Devices (LEC) Lester Eastman Conference on High Performance Devices (LEC), 2014. :1-3 Aug, 2014
Subject
Aerospace
Bioengineering
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
General Topics for Engineers
Photonics and Electrooptics
Power, Energy and Industry Applications
Gallium nitride
HEMTs
MODFETs
Logic gates
MMICs
Power amplifiers
Substrates
high electron mobility transistor
HEMT
gallium nitride
GaN
monolithic microwave integrated circuit
MMIC
millimeter-wave
MMW
power amplifier
wideband
Ka band
Language
Abstract
We report successful development of an advanced no-field-plate AlGaN/GaN high electron mobility transistors (HEMTs) for millimeter-wave (MMW) applications. The HEMT adopts a reduced source-drain spacing of 2 μm and the 0.2-μm gate is placed 0.5 μm off the source electrode. Additionally, the devices and monolithic microwave integrated circuits (MMICs) are fabricated on the SiC substrate of 2mil, enabling the fabrication of 15 μm × 25 μm slot via holes for realizing low inductance and more compact devices to facilitate MMW MMIC design. As a result, the narrow band MMICs have achieved an output power of 10.4 W with associated power added efficiency (PAE) of 31% at 28 GHz, and 10.7W and 27% at 36 GHz, respectively. Besides, a state-of-the-art 2-stage single-ended wideband MMIC demonstrates output power of 5–7.9 W and associated PAE of 13–21% from low K-band to high Ka-band.