학술논문

Counteractive Coupling IGZO/CNT Hybrid 2T0C DRAM Accelerating RRAM-based Computing-In-Memory via Monolithic 3D Integration for Edge AI
Document Type
Conference
Source
2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023
Subject
Bioengineering
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Nuclear Engineering
Photonics and Electrooptics
Power, Energy and Industry Applications
Robotics and Control Systems
Signal Processing and Analysis
Couplings
YOLO
Microprocessors
Random access memory
Computer architecture
Voltage
Videos
Language
ISSN
2156-017X
Abstract
In this work, we demonstrate a novel backend-of-the-line (BEOL) compatible IGZO/CNT hybrid-polarity 2T0C DRAM cell, which is further integrated on our analog RRAM-based monolithic 3D (M3D) integration platform for edge artificial intelligence (AI) applications. Incorporating n-type ultra-low-leakage InGaZnO x (IGZO) for write transistor and p-type high-current carbon nanotubes (CNTs) for read transistor, this design achieves a decent retention and desirably large read currents with a VLSI-compatible low data voltage (V data ). In addition, the unique IGZO-NFET/CNT-PFET hybrid-polarity 2T0C design enhances the effective sensing window and, more importantly, addresses the charge injection issue through counteractive coupling. This BEOL hybrid 2T0C cell achieves a long retention of 170s, a write speed of sub-20 ns and a read current of 29.7 μA/μm at V DS =1V with |V data | = 0.5V. The performance evaluation enables its utilization as a buffer layer on top of the computing-in-memory (CIM) layer with HfO 2 -based analog RRAM, empowering a prototype monolithic 3D chip (namely M3D-BRIC) for high-resolution (Hi-Res) videos processing. A YOLOv3 network is further implemented for the objects detection task, and the benchmarks show that the M3D-BRIC architecture of CIM/2T0C-DRAM could achieve a 48.25× higher processing capability than its 2D counterpart.