학술논문

Additive Manufacturing of Millimeter Wave Passive Circuits on Thin Alumina Substrates
Document Type
Conference
Source
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1852-1857 May, 2023
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Engineering Profession
Photonics and Electrooptics
Temperature measurement
Radio frequency
Performance evaluation
Silver
Sintering
Ink
Aerosols
Thin-Alumina Substrate
Additive Manufacturing
Millimeter wave
Microwave
passive devices
AerosolJet Printing
RF Systems
Language
ISSN
2377-5726
Abstract
Aerosol Jet Printing was used to fabricate microwave and millimeter wave passive devices (transmission lines, inductors, and a patch antenna) on thin alumina substrates. The devices were subjected to sintering temperatures 135 - 350°C and scattering parameters were recorded at each temperature step. Tape tests showed good adhesion of silver ink to the alumina substrate. All structures remained functional after 350°C sintering. The performance of the passive elements improved (due to reduction in conductor loss) with increase in sintering temperature. For example, both the microstrip transmission line and the coplanar waveguide (CPW) showed decreased loss after high-temperature sintering, with microstrip transmission line design improving from 0.1372dB/mm loss to 0.0653dB/mm after sintering at 350°C. Both the simulation and measured results for all the passive elements are presented in the paper.