학술논문
Experimental investigation on microstructural influence towards visco-plastic mechanical properties of Sn-based solder alloy for material modelling in finite element simulations
Document Type
Conference
Author
Source
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on. :1-8 Apr, 2015
Subject
Language
Abstract
The paper presents experimental results on tin-based solder alloys to their mechanical visco-plastic deformation behaviour under systematically investigation of cooling rates and their micro-structural solidification.