학술논문

Experimental investigation of the visco-plastic mechanical properties of a Sn-based solder alloy for material modelling in Finite Element calculations of automotive electronics
Document Type
Conference
Source
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on. :1-8 Apr, 2014
Subject
Components, Circuits, Devices and Systems
Strain
Abstracts
Temperature sensors
Degradation
Language
Abstract
Here, we present an advanced experimental procedure for determining the properties of a SnAg3.5 solder alloy in the strain range of primary creep under cyclic load and isothermal conditions. The challenge in this experiment is the accurate high-resolution measurement of sample elongation used for a closed-loop control, as well as avoiding the influence of sensor and specimen clamping. We realized reproducible strain rate control within a total specimen elongation of 60 µm. The tensile-compression experiment comprises strain rate variation for three strain amplitudes with integrated relaxation stages followed by a measurement of cyclic fatigue. The strain rate at every strain stage was varied in the range of 1E-3 to 1E-6 per second. At the end of every strain stage a time-limited relaxation experiment is performed, where the specimen's length is kept constant, while the stress evolution is recorded. Finally, the specimen is subjected to cyclic fatigue until a drop of 50 % of the initial materials strength is reached. The total procedure is performed in a temperature range from −40 to 150 °C. We prove the capability of common creep models to map the observed cyclic stress-strain hysteresis as well as stress dependency on strain rate. The results reveal substantial limitations of common stationary creep models and strongly suggest the application of advanced visco-plastic material models for an accurate description of the solder alloy properties. The experimental data presented can be used for the calibration of unified visco-plastic constitutive models initially proposed by Chaboché et al. and further extended during the past two decades.