학술논문

Shaping the Global High-Resolution TanDEM-X Digital Elevation Model
Document Type
Periodical
Source
IEEE Journal of Selected Topics in Applied Earth Observations and Remote Sensing IEEE J. Sel. Top. Appl. Earth Observations Remote Sensing Selected Topics in Applied Earth Observations and Remote Sensing, IEEE Journal of. 14:7198-7212 2021
Subject
Geoscience
Signal Processing and Analysis
Power, Energy and Industry Applications
Synthetic aperture radar
Coherence
Surface treatment
Smoothing methods
Filling
Surface topography
Interpolation
Digital elevation model (DEM)
editing
filtering
flood modeling
hydrology
interferometry
quality assessment
remote sensing
synthetic aperture radar (SAR)
Language
ISSN
1939-1404
2151-1535
Abstract
The global digital elevation model (DEM) produced by the TanDEM-X (TerraSAR-X add-on for digital elevation measurements) mission is an interferometric elevation model with unprecedented quality, accuracy, and coverage. It represents an unedited surface model as artifacts inherent to the interferometric synthetic aperture radar acquisition and processing technique are still present. The most prominent artifacts in the DEM are water bodies appearing with a rough surface due to low coherence. Additionally, outliers, voids, and larger data gaps may be present in this dataset. Therefore, DEM editing is crucial for many applications including hydrology or orthorectification of remote sensing data. Depending on the field of application, different techniques of quality enhancement are required. This article provides a comprehensive description of a semi-automatic framework specially developed for generating an edited version of the TanDEM-X dataset by shaping the high-resolution 12 m DEM with focus on water areas, outlier handling, and void filling. The default configuration parameters of the workflow can thereby be adapted interactively for challenging areas where appropriate. A quality assessment of the resulting edited DEM was done by statistical measures, visual methods, as well as by an artifact evaluation.