학술논문
In-Situ Delayering in Atomic Force Microscope for Sub-20nm Technology Devices
Document Type
Conference
Author
Source
2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2018 IEEE International Symposium on the. :1-4 Jul, 2018
Subject
Language
ISSN
1946-1550
Abstract
Atomic Force Microscopy (AFM) is traditionally used for measuring surface roughness and imaging in the nanometer scale. In this paper, we explore a novel technique in using the AFM probe tip to mechanically mill an IC sample to accurately reach a desired layer. Conductive AFM (CAFM) is also employed in conjunction with the in-situ delayering technique as a form of end-pointing and defect isolation. Different key parameters in the AFM were also explored in this paper to obtain an optimized milling process. The optimized process was then implemented to demonstrate the effectiveness of the technique.