학술논문

Investigation of Random Telegraph Noise in Advanced Silicon-On-Insulator N-FETs: The Impact of Back Bias, Strain, and Hot Carrier Stress
Document Type
Conference
Source
2023 International Conference on IC Design and Technology (ICICDT) IC Design and Technology (ICICDT), 2023 International Conference on. :116-119 Sep, 2023
Subject
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Photonics and Electrooptics
Power, Energy and Industry Applications
Robotics and Control Systems
Signal Processing and Analysis
Degradation
Integrated circuits
Simulation
Noise reduction
Silicon-on-insulator
Charge carrier density
Hot carrier effects
back bias
RTN
strain
TCAD simulation
UTBB
Language
ISSN
2691-0462
Abstract
In this work, the impact of hot-carrier (HC) induced degradation together with the effect of back bias (BB) on the random telegraph noise (RTN) in the SOI and tensile strained SOI n-FETs are investigated. It is found that the forward BB(FBB) can help to suppress the RTN of both the SOI and SSOI n-FETs with the former exhibiting larger improvement. Furthermore, as the ON time increases, n-FETs operated with FBB show less drain current $I_{\mathrm{D}}$ and RTN degradation as FBB pulls the carriers away from the top interface, reducing the occurrence of trapping/de-trapping and the generation of interface defects over time. The effect of FBB and reverse BB (RBB) on the RTN magnitude was explained by the change of carrier density distribution in the Si channel, according to the calibrated TCAD simulation results.