학술논문
Massively parallel simulation of multi-physics effects in sip using high-performance computing scheme
Document Type
Conference
Author
Source
2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017 IEEE. :1-3 Dec, 2017
Subject
Language
ISSN
2151-1233
Abstract
This paper presents the study of massively parallel simulation of multi-physics effects in SiP using a high-performance computing scheme. An in-house time-domain finite element parallel program is developed and validated by comparing the simulated electro-thermo-mechanical responses of bonding wire arrays with commercial software. After that, thermo-mechanical responses of SiP are simulated and the parallel efficiency of our parallel program is assessed by the experiment of its strong parallel scalability. Our parallel program can reach a Speedup of 6.095 and strong scalability efficiency of 38.1% on 1024 CPU cores of 128 compute nodes.