학술논문

Unveiling the Impact of High Frequency On-State and Off-State Operation on Gate Dielectric Reliability: A Comprehensive Analysis
Document Type
Conference
Source
2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023
Subject
Bioengineering
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Nuclear Engineering
Photonics and Electrooptics
Power, Energy and Industry Applications
Robotics and Control Systems
Signal Processing and Analysis
Temperature measurement
Voltage measurement
Current measurement
Logic gates
High frequency
Stress
Testing
Language
ISSN
2156-017X
Abstract
In this work, on-state (gate) bias and off-state (drain) bias time-dependent dielectric breakdown (TDDB) are studied across DC to AC to mimic real circuit operation. For the first time, investigation of lifetime difference between AC square to sinusoidal waveform is reported, which paves the way to understand TDDB performance towards GHz application. Through a variety of frequency and duty ratio (DR) combinations, extended AC lifetime gain at high frequency operation is demonstrated. In addition, higher AC gain for off-state bias than on-state bias is also shown in this work. Accordingly, an oxygen vacancy-based simulation model is developed to describe dynamic defect evolution upon stress time, in which trap recombination is proven to be one of the key factors for AC TDDB gain in both on-state and off-state bias conditions. This leads to a deceleration in percolation path formation in interfacial layer (IL), resulting in trap generation suppression in HK and thus an improvement in TDDB. The extended AC TDDB at GHz in this work underscores the significance of application-based reliability methodology in the context of scaled transistors and the development of More-than-Moore products.