학술논문
Evaluation and Numerical Simulation of Optimal Structural Designs for Reliable Packaging of Ultra Low K Process Technology
Document Type
Conference
Author
Source
2006 International Interconnect Technology Conference Interconnect Technology Conference, 2006 International. :92-94 2006
Subject
Language
ISSN
2380-632X
2380-6338
2380-6338
Abstract
The die edge-seals and circuit under fad (CUF) are structurally optimized through 3D finite element analysis (FEA). Die edge-seals having the mechanically reinforced structure units are demonstrated essential. It is also shown that FEA help extract useful structural design concepts for CUP. The Poisson effects leading to a dual-ring-shaped high stress distribution area are confirmed to be detrimental for wire bonding and wire-pull tests. Excellent agreements are obtained as compared with the experimental data