학술논문
A comprehensive approach to process control
Document Type
Conference
Author
Source
2012 SEMI Advanced Semiconductor Manufacturing Conference Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI. :278-283 May, 2012
Subject
Language
ISSN
1078-8743
2376-6697
2376-6697
Abstract
Embedded SiGe is widely used to boost the performance of the pFET device at recent technology nodes. We show that the thickness of the deposited SiGe layer has a strong impact on critical device parameters, which implies we require all process steps involved in its formation to be very strictly controlled. To achieve this we employ several methods that go beyond the usual controls on reproducibility and uniformity of etch and deposition processes. We also discuss some recommendations for incorporating these methods as part of the operational procedures in a Fab.