학술논문
Demonstration of Silicon-Photonics Hybrid Glass-Epoxy Substrate for Co-Packaged Optics
Document Type
Conference
Author
Source
2022 European Conference on Optical Communication (ECOC) Optical Communication (ECOC), 2022 European Conference on. :1-4 Sep, 2022
Subject
Language
Abstract
To realize a new package substrate for co-packaged optics, silicon-photonics hybrid glass-epoxy substrate with optical redistribution layer was demonstrated. 112 Gbps PAM-4 transmissions through the hybrid substrate were demonstrated with the TDECQ less than 3.4 dB.